Lead Free, RoHS Compliant Packaging Support From Lattice

"Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment."

• RoHS Compliance Letter

Corporate Commitment

Due to increased worldwide environmental concerns, the need for lead free solutions in electronic components and systems is receiving increasing attention within the semiconductor and electronics industries. Lattice is fully supportive of the various industry efforts throughout the world to phase out the use of lead and other undesirable elements from electronic equipment materials and manufacturing processes.

Lattice remains committed to continually reducing its impact on the world's natural environment and works closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from its products.

Resource Conservation

Environmental protection is more than just meeting standards. All corporate activities must be implemented with the environment in mind. Lattice's goal is to develop all new products such that they reduce space, materials and power consumption for an equivalent electrical function. In turn, this allows our customers to continually reduce their impact on the environment.

ISO14001

ISO14001 is an international standard for environmental management systems. Companies that are ISO14001 registered have demonstrated an internal program for the management of hazardous waste and implementation of recycling programs. This international recognition certifies a company's commitment to preserving the natural environment. All Lattice subcontract manufacturers are ISO14001 registered, and are routinely reviewed to ensure continued compliance.

Lead Free and RoHS Compliant Packaging Initiative

Lattice Semiconductor is a leader in the development of lead free packaging solutions. Lattice currently offers an extensive list of standard products in lead free packaging.

Lattice's lead free products are fully RoHS compliant, meeting the European Parliament Directive entitled "Restrictions on the use Of Hazardous Substances" (RoHS). This Directive prohibits the use of the following elements in electrical/electronic equipment sold after 7/1/2006: cadmium (Cd), lead (Pb), mercury (Hg), hexavalent chromium (Cr(VI)), polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Lattice's lead free products are compliant with this Directive today, well ahead of the July, 2006 deadline.

• Download Lattice packaging diagrams

Lattice's Lead Free Solutions

Lattice has qualified a wide variety of package types in lead free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Plastic DIP (PDIP), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Fine Pitch Super BGA (fpSBGA), Chip Scale BGA (csBGA) and Quad Flat-pack (QFN). To better facilitate the industry transition to lead free PLDs, Lattice offers the following broad assortment of standard, off-the-shelf, lead free product families.

¹ MSL4.

Note: Reference appropriate datasheet for valid part number and package combinations
 

Backward Compatible Packages

All of Lattice's lead free TQFP, PLCC, PQFP and QFN packages are "backward compatible" with conventional leaded manufacturing methodologies. This backward compatibility allows users to surface mount lead free packages onto lead based-PCBs and/or use lead free packaging with lead containing solders. Users can now procure a single, lead free component from Lattice and use it in either a leaded or lead free manufacturing environment without any issues. This capability greatly simplifies the inventory management challenges associated with migration from conventional lead based to lead free manufacturing.
 

Lead Free Reflow Profile

Lattice lead free packages are qualified to Level 1, 3 or 4 moisture resistance depending on the package type with peak reflow temperatures of 260°C, 250°C or 245°C, consistent with IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. Reliability tests include high temperature operating life (HTOL), surface mount preconditioning testing, temperature cycling, moisture resistance testing, biased highly accelerated stress test (HAST) and unbiased HAST. Lattice lead free products are qualified to the reflow profiles described in TN1076 - Solder Reflow Guide for Surface Mount Devices.

More Information

For more information, click on a link below to download an Adobe PDF document.

• Lattice Environmental Policy
• Environmental Management Information Letter
• Lead Free Packaging Product Brief
• TN1076 - Solder Reflow Guide for Surface Mount Devices
• PB1227C - Matte Tin Plating Whisker Data
• Customer Awards
• ISO14000 Certificates
• Package Device Material Content Breakdowns